PHOTONIC WIRE BONDING

Dream Photonics provides rapid prototyping and process development for integrating photonic components via photonic wire bonds.

Dream Photonics provides rapid prototyping and process development for integrating photonic components via photonic wire bonds.

Photonic wire bonds (PWBs): A high-yield, low-insertion-loss, and high-throughput versatile method of packaging photonic components such as chip-to-fiber, laser-to-chip interconnects. Utilizing a two-photon polymerization to fabricate freeform polymer structures, PWBs can connect components with arbitrarily disparate mode field shapes and sizes. Capabilities and advantages of the PWB technique include:

Gain chip integration with existing ’known good die’

Dense optical I/O connections to the chip

Interconnects that are not possible with standard photonic packaging techniques

Scalability - from prototyping to high-volume

Menagerie of components integrated with photonic wire bonds or lenses

  • Lenses for vertical emission/collection

  • Fiber to fiber connections

  • On-chip SOA integration

  • On-chip waveguide-to-waveguide bridges

  • Lenses for edge coupling

  • Fiber-to-laser integration

  • On-chip laser integration

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Offerings

Polymer Lenses

Laser Integration

Fiber Integration